Gas phase precipitated polymers as highly insulating chip backside layer
AssigneeInfineon Technologies AG
InventorsManfred Mengel, Joachim Mahler
Life of this patent
Estimating the term…
Abstract
A method for producing semiconductor chips has the following steps for this purpose: firstly, a semiconductor wafer having a multiplicity of semiconductor chip positions arranged in rows and columns is provided, wherein the semiconductor wafer has on its front side front sides of semiconductor chips with integrated circuits. The rear side of the semiconductor wafer is provided with a coating having Parylene. The semiconductor wafer is subsequently singulated into semiconductor chips having rear sides on which the coating having Parylene is arranged.
Claims38
1-31. (canceled)
A method for producing semiconductor chips, comprising:
- providing a semiconductor wafer having a multiplicity of semiconductor chip positions arranged in rows and columns, wherein the semiconductor wafer has on its front side front sides of semiconductor chips with integrated circuits;
- coating a rear side of the semiconductor wafer with a coating having Parylene;
- and
- singulating the semiconductor wafer into semiconductor chips with rear sides on which the coating having Parylene is arranged.
A method for producing semiconductor chips, comprising:
- providing a semiconductor wafer having a multiplicity of semiconductor chip positions arranged in rows and columns, wherein the semiconductor wafer has on its front side front sides of semiconductor chips with integrated circuits;
- applying the semiconductor wafer by its front side onto a sawing film and singulating the semiconductor wafer into semiconductor chips;
- coating rear sides of the semiconductor chips with a coating having Parylene;
- and
- removing the coated semiconductor chips from the sawing film.
A semiconductor power module, comprising:
- a power substrate;
- at least one power semiconductor chip arranged on the power substrate;
- at least one driver chip having an active front side and a rear side, wherein the driver chip is mounted by the rear side onto the power substrate, wherein the driver chip has a coating having Parylene on the rear side.
A semiconductor wafer comprising:
- a multiplicity of semiconductor chip positions arranged in rows and columns;
- a front side and a rear side, wherein the front side receives front sides of semiconductor chips with integrated circuits;
- and
- a coating having Parylene arranged on the rear side of the semiconductor wafer.
Dependencies are inferred from the claim text.