Thermally decomposable spin-on bonding compositions for temporary wafer bonding
AssigneeBrewer Science Inc.
InventorSunil K. Pillalamarri
Life of this patent
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Abstract
New spin-on, bonding compositions and methods of using those compositions are provided. The cured bonding compositions comprise a crosslinked oxazoline (either crosslinked with another oxazoline or with a crosslinking agent), and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can be thermally decomposed at 285° C. or higher to allow the wafers to slide apart at the appropriate stage in the fabrication process.
Claims25
A wafer bonding method comprising:
- providing a stack comprising first and second substrates bonded together via a bonding composition layer comprising crosslinked oxazoline groups;
- and
- exposing said stack to a temperature of at least about 285° C. so as to thermally decompose said bonding composition layer and cause said first and second substrates to separate.
An article comprising:
- a first substrate having a back surface and an active surface;
- a second substrate having a bonding surface;
- and
- a bonding composition layer bonded to said active surface aid to said bonding surface, said bonding composition layer comprising crosslinked oxazoline groups.
Dependencies are inferred from the claim text.