Image sensor and method for manufacturing the same
AssigneeDongbu HiTek Co., Ltd.
InventorWoo Seok Hyun
Life of this patent
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Abstract
Disclosed is an image sensor, which includes a dielectric layer on a substrate having a photodiode, a metal interconnection layer on the dielectric layer and an upper insulating layer on the metal interconnection layer. The metal interconnection layer includes a lower barrier layer, a bulk metal layer on the lower barrier layer and an upper barrier layer on the bulk metal layer having a predetermined thickness which is 0.8 to 1.5 times as thick as the lower barrier layer.
Claims20
An image sensor comprising:
- a dielectric layer on a substrate having a photodiode;
- a metal interconnection layer on the dielectric layer;
- and
- an upper insulating layer on the metal interconnection layer,
- wherein the metal interconnection layer includes a lower barrier layer, a bulk metal layer on the lower barrier layer, and an upper barrier layer on the bulk metal layer in a predetermined thickness which is 0.8 to 1.5 times a thickness of the lower barrier layer.
A method of manufacturing an image sensor, the method comprising the steps of:
- forming a dielectric layer on a substrate having a photodiode;
- forming a lower barrier layer on the interlayer dielectric;
- forming a bulk metal layer on the lower barrier layer;
- forming an upper barrier layer on the bulk metal layer in a predetermined thickness, which is 0.8 to 1.5 times a thickness of the lower barrier layer;
- forming an upper insulating layer on the upper barrier layer;
- and
- sintering the substrate having the upper insulating layer.
A method of manufacturing an image sensor, the method comprising the steps of:
- forming a dielectric layer on a substrate having a photodiode;
- forming a metal interconnection layer on the dielectric layer;
- forming an upper insulating layer on the metal interconnection layer;
- forming a sacrificial layer on the upper insulating layer;
- sintering the substrate having the sacrificial layer;
- and
- removing the sacrificial layer from the substrate that has been sintered.
Dependencies are inferred from the claim text.