Elevated pocket pixels, imaging devices and systems including the same and method of forming the same
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
An elevated photosensor for image sensors and methods of forming the photosensor. The photosensor may have light sensors having indentation features including, but not limited to, v-shaped, u-shaped, or other shaped features. Light sensors having such an indentation feature can redirect incident light that is not absorbed by one portion of the photosensor to another portion of the photosensor for additional absorption. In addition, the elevated photosensors reduce the size of the pixel cells while reducing leakage, image lag, and barrier problems.
Claims23
An imaging device comprising:
- a photosensitive region formed above a substrate;
- and
- at least one indentation feature formed in the photosensitive region and being adapted to redirect reflected light from one portion of the photosensitive region to another portion of the photosensitive region.
An imaging pixel having a raised photosensor, the raised photosensor comprising:
- a substrate having a first surface level;
- a first doped layer of a first conductivity type formed in the substrate;
- a second doped layer of a second conductivity type formed over the first doped layer at a second elevated surface level, the second doped layer has at least one feature on an upper surface for redirecting light from one portion of the photosensitive region to another portion of the photosensitive region;
- and
- a third doped layer of a first conductivity type formed on the upper surface of the at least one feature.
An imager device comprising:
- an array of pixels, each pixel comprising:
- a photosensitive region formed above a substrate;
- and
- at least one trench comprising photosensitive material formed in the photosensitive region for redirecting reflected light from one portion of the photosensitive region.
A method of forming a photosensor comprising the steps of:
- providing a semiconductor substrate having a first doped layer of a first conductivity type;
- forming a second doped region of a second conductivity type to define a photosensitive area above the semiconductor substrate;
- forming at least one trench in the second doped region for redirecting reflected light from one portion of the photosensitive region to another portion of the photosensitive region;
- and
- forming a third doped region of the first conductivity type over the second doped region.
A system comprising:
- a processor;
- a pixel array coupled to the processor comprising:
- a photosensor having a photosensitive area, wherein the photosensitive area has at least one trench on a top surface for redirecting reflected light from one portion of the photosensitive region to another portion of the photosensitive region.
A camera system comprising:
- a pixel array coupled to an image processor, the image processor having an imaging device comprising:
- a photosensitive region formed above a substrate;
- and
- at least one indentation feature formed in the photosensitive region and being adapted to redirect reflected light from one portion of the photosensitive region to another portion of the photosensitive region.
Dependencies are inferred from the claim text.