Back to results
US 2008/0173902 A1Published application
Solid state imaging apparatus, imaging apparatus and solid state imaging apparatus manufacturing method
AssigneeFUJIFILM Corporation
InventorsJiro MATSUDA, Masanori Nagase, Shu Takahashi
Life of this patent
Estimating the term…
Abstract
A solid state imaging apparatus comprises: a semiconductor substrate; a photoelectric converting portion on the semiconductor substrate; a light shielding film in a region excluding a light receiving surface of the photoelectric converting portion; and a P-type impurity layer between a lower surface of the light shielding film and the semiconductor substrate.
Claims13
A solid state imaging apparatus comprising:
- a semiconductor substrate;
- a photoelectric converting portion on the semiconductor substrate;
- a light shielding film in a region excluding a light receiving surface of the photoelectric converting portion;
- and
- a P-type impurity layer between a lower surface of the light shielding film and the semiconductor substrate.
2 more elements
Dependencies are inferred from the claim text.