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US 2008/0173892 A1Published application
Package structure
AssigneeLighthouse Technology Co., Ltd.
InventorWei-An Chen
Life of this patent
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Abstract
A package structure including a carrier, a molding element and a chip is provided. A part of the carrier is enclosed by the molding element. The molding element has a top portion and a bottom portion opposite to the top portion, wherein the top portion has a cavity exposing a part of the carrier and the bottom portion has a first protrusion and two second protrusions located at both sides of the first protrusion. The chip is disposed in the cavity and electrically connected to the carrier.
Claims12
A package structure, comprising:
- a carrier;
- a molding element, enclosing a part of the carrier and having a top portion and a bottom portion opposite to the top portion, wherein the top portion has a cavity exposing a part of the carrier and the bottom portion has a first protrusion and two second protrusions located at both sides of the first protrusion;
- and
- a chip, disposed in the cavity and electrically connected to the carrier.
1 more element
Dependencies are inferred from the claim text.