Light emitting diode chip package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSergiy Shylo, Mi Jeong Yun
Life of this patent
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Abstract
A light emitting diode (LED) chip package including: a package body; an LED chip mounted on the package body and emitting an excited light; a phosphor layer including a phosphor absorbing the excited light and emitting a wavelength conversion light obtained by converting a wavelength of the excited light and a phosphor resin mixed with the phosphor; and a reflector layer including a reflector formed between the LED chip and the phosphor layer, transmitting the excited light to the phosphor layer, and reflecting the wavelength conversion light from the phosphor layer, and a reflector resin mixed with the reflector.
Claims13
A light emitting diode (LED) chip package comprising:
- a package body;
- an LED chip mounted on the package body and emitting an excited light;
- a phosphor layer including a phosphor absorbing the excited light and emitting a wavelength conversion light obtained by converting a wavelength of the excited light and a phosphor resin mixed with the phosphor;
- and
- a reflector layer including a reflector formed between the LED chip and the phosphor layer, transmitting the excited light to the phosphor layer, and reflecting the wavelength conversion light from the phosphor layer, and a reflector resin mixed with the reflector.
Dependencies are inferred from the claim text.