Light-emitting diode chip package body and packaging method thereof
AssigneeSuzhou Industrial Park Tony Lighting Technology Co., Ltd.
InventorYu-Nung Shen
Life of this patent
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Abstract
AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
Claims10
A light-emitting diode chip package body, comprising:
- a light-emitting diode chip having a pad-installed surface formed thereon, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface;
- a light-reflecting coating disposed on the rear surface of the light-emitting diode chip;
- an insulative protective layer formed on the light-reflecting coating;
- a surface insulation layer disposed on the rear surface of the light-emitting diode chip, and having a central through hole for exposure of a central portion of the rear surface and a plurality of pad-exposed holes for exposure of the corresponding pads;
- a first light-transparent element received in the central through hole of the insulative protective layer;
- and a plurality of conductive projecting blocks, each conductive projecting block being disposed on a corresponding pad of the light-emitting diode.
Dependencies are inferred from the claim text.