Wafer level phosphor coating method and devices fabricated utilizing method

A method for fabricating LED chips, comprising:

• flip-chip bonding a plurality of LEDs on a carrier substrate;
• forming a conductive pedestal in electrical contact with each of the LEDs;
• forming a coating over said LEDs, said coating burying at least some of said pedestals;
• and
• planarizing said coating to expose at least some of said buried pedestals.

A method for fabricating coated semiconductor devices, comprising:

• providing a plurality of semiconductor devices on a substrate;
• depositing pedestals on said semiconductor devices, each of which is in electrical contact with one of said semiconductor devices;
• forming a coating over said semiconductor devices, said coating burying at least some of said pedestals;
• and
• planarizing said coating leaving at least some of said coating material on said semiconductor devices while exposing at least some of said buried pedestals for contacting.

A light emitting diode (LED) chip wafer, comprising:

• a plurality of LEDs;
• a plurality of pedestals, each of which is in electrical contact with one of said LEDs;
• and
• a coating at least partially covering said LEDs, at least some of said pedestals extending through and to the surface of said coating and exposed at the surface of said coating.

An light emitting diode (LED) chip, comprising:

• an LED;
• a pedestal in electrical contact with said LED;
• and
• a coating at least partially covering said LED, said pedestal extending through and to the surface of said coating and exposed at the surface of said coating.

A light emitting diode (LED) package comprising:

• an LED chip;
• a pedestal in electrical contact with said LED chips;
• and
• a coating at least partially covering said LED chip, said pedestal extending through and to the surface of said coating and exposed at the surface of said coating;
• package leads, said pedestal in electrical connection with one of said package leads;
• and
• encapsulation surrounding said LED chip and electrical connections.

A light emitting diode (LED) package comprising:

• an LED chip;
• a pedestal in electrical contact with said LED chips;
• and
• a coating at least partially covering said LED chip, said pedestal extending through and to the surface of said coating and exposed at the surface of said coating;
• and
• package leads, said pedestal in electrical connection with one of said package leads, wherein the chip is enclosed by a hermetically sealed cover.