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US 2008/0173858 A1Published application
Phase change memory devices including carbon-containing adhesive pattern, and methods of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyeong-Geun An, Hideki Horii, Min-Young Park, Shin-Hye Kim
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Abstract
Phase change memory devices include a heating electrode on a substrate and a phase change material pattern on the heating electrode. An adhesive pattern is disposed between the heating electrode and the phase change material pattern. The adhesive pattern contains carbon. Methods of fabricating phase change memory devices are also provided.
Claims21
A phase change memory device, comprising:
- a substrate;
- a heating electrode on the substrate;
- a phase change material pattern on the substrate;
- and
- an adhesive pattern disposed between the heating electrode and the phase change material pattern, the adhesive pattern comprising carbon.
2 more elements
A method of fabricating a phase change memory device, the method comprising:
- forming a heating electrode on a substrate;
- forming an adhesive pattern on the heating electrode, the adhesive pattern comprising carbon;
- and
- forming a phase change material pattern on the adhesive pattern.
1 more element
14-21. (canceled)
Dependencies are inferred from the claim text.