US 2008/0173792 A1 · Image sensor module and the method of the same

Abstract

The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

Claims23

Dependent claims

An image sensor module structure comprising:

a substrate with a first die receiving cavity formed within an upper surface of said substrate and conductive traces within said substrate;
a first die having a micro lens disposed within said first die receiving cavity;
a first dielectric layer formed on said first die and said substrate;
a first re-distribution conductive layer (RDL) formed on said first dielectric layer, wherein said first RDL is coupled to said first die and said conductive traces, wherein said first dielectric layer has an opening to expose said micro lens;
a lens holder attached on said substrate, said lens holder having a lens attached an upper portion of said lens holder.

2 more elements

Dependencies are inferred from the claim text.

Image sensor module and the method of the same

Life of this patent

Image sensor module and the method of the same

Life of this patent

Abstract

Claims23