US 2008/0173700 A1 · SYSTEM AND METHOD FOR SOLDER BONDING

Abstract

A volatile soldering aid for solder bonding surfaces. A thermally decomposable solid that is suspended in a carrier or dissolved in a solvent is incorporated in a solder assembly having two surfaces separated by a solder preform. The solvent or carrier is subsequently evaporated, and the assembly is heated to decompose the solid and produce a reducing gas. The assembly is then further heated to melt the solder preform. A vacuum may be introduced to remove the gas prior to melting of the solder preform. The solder preform in the assembly may be a monolithic preform or it may be a powder. The solder preform may be provided as a thin film deposited on one or both of the surfaces to be joined. Upon heating, the volatile soldering aid is converted to vapor without forming a liquid phase at the melting point of the solder.

Claims20

Dependent claims

A system for solder bonding with a volatile soldering aid comprising:

a first component including a first bonding surface;
a second component including a second bonding surface;
solder preform disposed between said first bonding surface and said second bonding surface;
a thermally decomposable solid disposed between said first bonding surface and said second bonding surface;
a chamber enclosing said first component and said second component;
a heat source coupled to said chamber;
and
wherein said thermally decomposable solid is convertible entirely to a vapor phase at the melting point of said solder.

5 more elements

Dependencies are inferred from the claim text.

System and method for solder bonding

Life of this patent

System and method for solder bonding

Life of this patent

Abstract

Claims20