Method for Attachment of Solder Powder to Electronic Circuit Board and Solder-Attached Electronic Circuit Board
AssigneeShowa Denko K.K.
InventorsTakashi Shoji, Takekazu Sakai, Tetsuo Kubota
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Abstract
A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
Claims12
A method for the attachment of solder powder, comprising the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid.
4 A method according to claim 3, wherein the deoxidized water is added with an antirust.
A method for the production of a soldered electronic circuit board, comprising the steps of treating an electronic circuit board with a tackifier compound, thereby imparting tackiness exclusively to an exposed part of a metallic circuit to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, then removing excessively adhering solder powder in a liquid kept vibrated, and subjecting the resultant board to thermal fusion, thereby forming a circuit.
A method for the production of a solder-attached electronic circuit board, comprising the steps of imparting tackiness exclusively to an exposed part of a metallic circuit on an electronic circuit board by a treatment with a tackifier compound to form a tackified part, attaching solder powder to the tackified part by a dry or wet process, removing excessively attached solder powder in a liquid, recovering the removed solder powder and reusing the removed solder powder.
Dependencies are inferred from the claim text.