Materials for use with interconnects of electrical devices and related methods
AssigneeAlpha Assembly Solutions Inc.
InventorsMichael T. Marczi, Paul Koep, Michel A. de Monchy, Martinus N. Finke, Brian Lewis
Life of this patent
Estimating the term…
Abstract
Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
Claims22
A method of providing an electrical connection between two or more electrical components in an electrical device, the method comprising:
- disposing a two-step solder on or between some portion of the two or more electrical components, the two-step solder comprising a low melt solder component disposed on a base solder component;
- melting the low melt solder component of the two-step solder at an effective temperature to form a solder alloy or intermetallic from the low melt component and the base solder component;
- and
- soldering the solder alloy or intermetallic to provide an electrical connection between the two or more electrical components.
A method of providing an electrical connection in a solar cell assembly comprising a circuit board and a silicon-containing layer, the method comprising:
- disposing a two-step solder on or between the circuit board and the silicon-containing layer;
- the two-step solder comprising a low melt solder component disposed on a base solder component;
- melting the low melt solder component of the two-step solder to form a solder alloy or an intermetallic from the low melt solder component and the base solder component;
- and
- soldering the solder alloy or intermetallic to provide an electrical connection between the circuit board and the silicon-containing layer.
A method of producing a solar cell assembly comprising:
- disposing a circuit board on a backing layer;
- disposing at least one two-step solder preform on an electrical contact on the circuit board, the two-step solder preform comprising a low melt solder component disposed on a base solder component;
- disposing a solar cell on the circuit board and the at least one solder preform;
- disposing a protective layer on the solar cell to provide a solar cell assembly;
- applying least one of heat and pressure to the solar cell assembly to melt the low melt solder component to form a solder alloy or intermetallic from the low melt solder component and the base solder component;
- and
- soldering the solder alloy through the protective layer to provide an electrical connection between the circuit board and the solar cell.
The method of claim 21, in which the steps of applying at least one of heat and pressure and the soldering laminates the solar cell assembly.
22-37. (canceled)
Dependencies are inferred from the claim text.