Method and apparatus for the correction of defective solder bump arrays
AssigneeSUSS MicroTec Test Systems GmbH
InventorsEnrico Herz, Michael Teich, Axel Becker
Life of this patent
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Abstract
Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.
Claims15
A method for correcting defective solder-bump-arrays, in which in an arrangement of solder bumps located in cavities of a mold a missing solder bump is searched, identified, and located, and subsequently replaced by a prefabricated solder bump.
A device for correcting defective solder-bump-arrays in a mold provided with a multitude of cavities for accepting solder bumps, comprising a mold carrier, identification and locating device for finding and locating missing solder bumps, and a repair device for accepting, transporting, and inserting a prefabricated solder bump into cavities of the missing solder bumps.
Dependencies are inferred from the claim text.