Apparatuses and methods for irradiating a substrate to avoid substrate edge damage
AssigneeUltratech, Inc.
InventorsBoris Grek, David A. Markle
Life of this patent
Estimating the term…
Loading patent…
AssigneeUltratech, Inc.
InventorsBoris Grek, David A. Markle
Estimating the term…
Apparatuses and methods are provided for processing a substrate having an upper surface that includes a central region, a peripheral region, and an edge adjacent to the peripheral region. An image having an intensity sufficient to effect thermal processing of the substrate is scanned across the upper surface of the substrate. The image scanning geometry allows processing the central region of the substrate at a substantially uniform temperature without damaging the outer edge. In some instances, the image may be formed from a beam traveling over at least a portion of the central region so that no portion thereof directly illuminates any portion of the edge when the image is scanned across the periphery region. The substrate may be rotated 180° or the beam direction may be switched after part of the scanning operation has been completed.
An apparatus for processing a substrate having an upper surface that includes a central region, a peripheral region, and an edge adjacent to the peripheral region and perpendicular to the upper surface, said apparatus comprising:
A method for processing a substrate having an upper surface that includes a central region, a peripheral region, and an edge adjacent to the peripheral region and perpendicular to the upper surface, said method comprising the steps of:
A method for processing a substrate having an upper surface divided into first and second regions and an edge adjacent to the upper surface, said method comprising the steps of:
Dependencies are inferred from the claim text.