Magnetron Sputtering Source, Sputter-Coating Installation, and Method for Coating a Substrate

Magnetron sputtering source for a coating installation, comprising a cathode and a target assigned to the cathode or formed as the cathode, said target providing coating and/or treatment material for the coating and/or treatment,

• means for generating a coating plasma,
• a magnet arrangement for generating a magnetic filed for influencing the coating plasma in such a manner that a plasma channel is generating above a partial section of a surface of the target, with the magnet arrangement and the partial section of a surface of the target arranged such that the magnet arrangement and the surface of the target may be moved relative to each other by a drive,
• wherein said drive is adjusted such that a relative movement between the magnet arrangement and the surface of the target exceeds a velocity of at least 0.1 m/s during one coating cycle.

Magnetron sputtering source for a coating installation comprising a cathode and a target assigned to the cathode or formed as the cathode, said target providing coating and/or treatment material for the coating and/or treatment,

• means for generating a coating plasma,
• a magnet arrangement for generating a magnetic field for influencing the coating plasma in such a manner that a plasma channel is generated above a partial section of a surface of the target, with the magnet arrangement and the surface of the target arranged such that the magnet arrangement and the surface of the target may be moved relative to each other,
• wherein the magnet sputtering source is adjustable such that the a power density, at least intermittently, reaches a value of at least 5 W/cm2, with a relative velocity (v, v+u) of the magnet arrangement and the target being set high enough as a function of the power density and/or a sputtering rate to rule out undesirable temperature-induced surface effects on the surface of the target.