Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same

A semiconductor device comprising:

• a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, the bump being provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, with a cross sectional shape of the bump taken in a width direction of the wiring layer being such that a central portion is higher than both side portions and an upper surface has a rounded shape;
• and
• a semiconductor chip mounted on the circuit board,
• wherein electrode pads of the semiconductor chip are connected to the wiring layers via the bumps.

A semiconductor device comprising:

• a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, the bump being provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, with a cross sectional shape of the bump taken in a width direction of the wiring layer being such that a thickness of the bump from the upper surface of the wiring layer is larger than a thickness of the bump from the side face of the wiring layer;
• and
• a semiconductor chip mounted on the circuit board,
• wherein electrode pads of the semiconductor chip are connected to the wiring layers via the bumps.

A semiconductor device comprising:

• a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, an upper surface of the wiring layer being flat, and the bump being provided across a longitudinal direction of a corresponding on of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, with a cross sectional shape of the bump taken in a width direction of the wiring layer being such that a central portion is higher than both side portions;
• and
• a semiconductor chip mounted on the circuit board,
• wherein electrode pads of the semiconductor chip are connected to the wiring layers via the bumps.