Printed circuit board and electronic apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsMinoru Takizawa, Kazuhiko Nagao, Kiyokazu Ishizaki, Kuniyasu Hosoda
Life of this patent
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Abstract
According to one embodiment, a printed circuit board includes a printed wiring board including a through hole part, an electronic component including a component body and a lead member inserted into the through hole part to be electrically connected thereto, a metal member disposed around and separated from the through hole part, and a solder resist disposed at least around the metal member, at least a part of the component body being mounted on the solder resist
Claims11
A printed circuit board comprising:
- a printed wiring board comprising a through hole part;
- an electronic component comprising:
- a component body;
- and
- a lead member inserted into the through hole part to
- be electrically connected thereto;
- a metal member disposed around and separated from the through hole part;
- and
- a solder resist disposed at least around the metal member, at least a part of the component body being mounted on the solder resist.
An electronic apparatus comprising:
- a casing;
- and
- a printed circuit board which is contained in the casing, the printed circuit board comprising:
- a printed wiring board comprising a through hole part;
- an electronic component comprising:
- a component body;
- and
- a lead member inserted into the through hole part to be electrically connected thereto;
- a metal member disposed around and separated from the through hole part;
- a solder resist disposed at least around the metal member, a part of the component body being mounted on the solder resist.
A method for manufacturing a printed circuit board, comprising:
- forming a through hole part in a printed wiring board;
- disposing a metal member around and separated from the through hole part;
- disposing a solder resist at least around the metal member;
- applying a solder paste to the through hole part;
- inserting a lead member of an electronic component into the through hole part;
- mounting at least a part of a component body of the electric component on the solder resist;
- and
- soldering the electronic component to the printed wiring board.
Dependencies are inferred from the claim text.