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US 2008/0173471 A1Published application
Element substrate and method of manufacturing the same
AssigneeSeiko Epson Corporation
InventorsToshihiko Kaneda, Satoshi Kimura, Hidemichi Furihata, Jun Amako, Daisuke Sawaki, Takeshi Kijima
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Abstract
An element substrate including a substrate and a metal layer formed on the substrate by electroless plating and including a linear portion having a width of 10 nm to 100 nm.
Claims19
A method of manufacturing an element substrate comprising:
- (a) forming a sacrificial layer with a first pattern on a substrate;
- (b) forming a metal layer over a formation region and a non-formation region of the sacrificial layer;
- and
- (c) removing the sacrificial layer by heating to give a second pattern to the metal layer.
1 more element
An element substrate comprising:
- a substrate;
- and
- a metal layer formed on the substrate by electroless plating and including a linear portion having a width of 10 nm to 100 nm.
Dependencies are inferred from the claim text.