US 2008/0173470 A1 · Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards

Abstract

A circuit board, in one embodiment a printed wiring board (PWB); in a second embodiment a substrate for an ASIC (Application Specific Integrated Circuit) or Chip Carrier; and a method of manufacturing the same. In one embodiment, the PWB, ASIC or Chip Carrier includes: (1) a substrate having a conductive trace located thereon and (2) a combined, multi-purpose surface finish utilizing an electroless or electrolytically deposited nickel under-plate finished with a coating of an organic solderability preservative (OSP) and is located on at least a portion of the conductive areas (trace, pad, fingers, etc), which forms both a non-contact finish and a contact finish for the PWB, ASIC or Chip Carrier.

Claims11

Dependent claims

A printed wiring board (PWB), ASIC or Chip Carrier, comprising:

a substrate having at least one conductive trace thereon, said conductive trace consisting of:
A copper or copper alloy laminate layer located on said substrate, defining a pattern of said trace on said substrate;
An intermediate copper layer located on said laminate layer;
and
A combined, multi-purpose finish consisting of nickel (electroless or electrolytically deposited) under-plate located on said intermediate layer;
and an organic solderability preservative (OSP) deposited on top of the under-plate nickel, that forms both a non-contact and a contact finish for said PWB, ASIC or Chip Carrier.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/163,034Filed 3 Oct 2005

Published

24 Jul 2008

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

H05K 3/282
Applying non-metallic protective coatings: for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
H05K 3/244
Reinforcing of the conductive pattern: finish plating of conductors, especially of copper conductors, e.g. for pads or lands
H05K 2203/072
Plating: electroless plating, e.g. finish plating or initial plating
H05K 2203/124
Organic non-polymeric compounds, e.g. oil, wax or thiol: heterocyclic organic compounds, e.g. azole, furan

Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards

Life of this patent

Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards

Life of this patent

Abstract

Claims11