Multilayer wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorEiichi Hirakawa
Life of this patent
Estimating the term…
Abstract
A multilayer wiring board having a structure in which wiring layers 12A to 12D and insulating layers 11A to 11C are alternately arranged, and in which one or plural kinds of wirings selected from a group of a signal wiring 25 having a signal electrode 15, a power supply wiring 26 having a power supply electrode 16, and a ground wiring 27 having a ground electrode 17 are formed on each of the wiring layers 12A to 12D. The signal wiring 25 and the power supply wiring 26 are alternately provided on the insulating layers. Alternatively, the signal wiring 25 and the ground wiring 27 are alternately provided on the insulating layers.
Claims6
A multilayer wiring board comprising:
- wiring layers, and
- insulating layers,
- the wiring layers and the insulating layers being alternately arranged, and
- one or plural kinds of wirings selected from a group of a signal wiring having a signal electrode, a ground wiring having a ground electrode and a power supply wiring having a power supply electrode which are formed on each of the wiring layers, wherein
- the signal wiring and the power supply wiring are alternately provided on the insulating layers.
A multilayer wiring board comprising:
- wiring layers, and
- insulating layers,
- the wiring layers and the insulating layers being alternately arranged, and
- one or plural kinds of wirings selected from a group of a signal wiring having a signal electrode, a ground wiring having a ground electrode and a power supply wiring having a power supply electrode which are formed on each of the wiring layers, wherein
- the signal wiring and the ground wiring are alternately provided on the insulating layers.
A multilayer wiring board comprising:
- wiring layers, and
- insulating layers,
- the wiring layers and the insulating layers being alternately arranged, and
- one or plural kinds of wirings selected from a group of a signal wiring having a signal electrode, a ground wiring having a ground electrode and a power supply wiring having a power supply electrode which are formed on each of the wiring layers, wherein
- a wiring placed in an arranging direction just above or just below the signal wiring formed on one of a plurality of the arranged wiring layers is the ground wiring or the power supply wiring.
A multilayer wiring board comprising:
- wiring layers, and
- insulating layers,
- the wiring layers and the insulating layers being alternately arranged, and
- one or plural kinds of wirings selected from a group of a signal wiring having a signal electrode, a ground wiring having a ground electrode and a power supply wiring having a power supply electrode which are formed on each of the wiring layers, wherein
- the signal wiring and the power supply wiring are alternately provided on the insulating layers,
- the signal wiring and the ground wiring are alternately provided on the insulating layers, and
- a wiring placed in an arranging direction just above or just below the signal wiring formed on one of a plurality of the arranged wiring layers is the ground wiring or the power supply wiring.
Dependencies are inferred from the claim text.