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US 2008/0173468 A1Published application
Wiring substrate, method for manufacturing the same, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorToshiki HARA
Life of this patent
Estimating the term…
Abstract
A wiring substrate comprises: a flexible substrate having a first region and a second region; a wiring line formed on the flexible substrate; and an electronic element that is disposed on the flexible substrate in the first region and electrically coupled to the wiring line. Flexibility of the first region is lower than flexibility of the second region.
Claims11
A wiring substrate, comprising:
- a flexible substrate having a first region and a second region;
- a wiring line formed on the flexible substrate;
- and
- an electronic element that is disposed on the flexible substrate in the first region and electrically coupled to the wiring line, wherein flexibility of the first region is lower than flexibility of the second region.
1 more element
A method for manufacturing a wiring substrate, comprising:
- forming a wiring line on a flexible substrate having a first region and a second region;
- reducing flexibility of the first region of the flexible substrate;
- and
- fixing an electronic element to the first region.
1 more element
A method for manufacturing a wiring substrate, comprising:
- reducing flexibility of a first region of a flexible substrate;
- forming a wiring line on the flexible substrate;
- and
- fixing an electronic element to the first region.
1 more element
A method for manufacturing a wiring substrate, comprising:
- forming a wiring line on a flexible substrate;
- fixing an electronic element to a first region of the flexible substrate;
- and
- reducing flexibility of the first region.
1 more element
Dependencies are inferred from the claim text.