Heat dissipation device with heat pipes
AssigneeFoxconn Technology Co., Ltd.
InventorsPING-AN YANG, MENG FU, CHUN-CHI CHEN
Life of this patent
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Abstract
A heat dissipation device includes a base for contacting an electronic device. Two first heat pipes are arranged on and thermally engaged with the base for absorbing heat from the electronic device and spread the heat to the base. Each of the two first heat pipes is sinuous and defines two U-shaped portions on the base. Two second heat pipes are thermally engaged with the base for absorbing heat from the electronic device and spreading the heat to the base. Each of the two second heat pipes has a first section located at a corresponding one of the two U-shaped portions on the base. A fin set is located on the base for dissipating heat in the base to ambient air.
Claims16
A heat dissipation device for removing heat from a heat generating electronic device, the heat dissipation device comprising:
- a base for contacting with the electronic device;
- two first heat pipes being arranged on the base and thermally engaged with the base, each of the two heat pipes being sinuous and forming two U-shaped portions on the base;
- two second heat pipes thermally engaged with the base, each of the two second heat pipes comprising a first section located in corresponding one of the two U-shaped portions of the first heat pipes on the base;
- and
- a fin set thermally contacting the base for dissipating the heat in the base.
The heat dissipation device of claim 10, wherein the two second heat pipes each are substantially U-shaped in profile.
A heat dissipation device for dissipating heat generated by an electronic device, the heat dissipation device comprising:
- a base for contacting the electronic device;
- two first heat pipes thermally engaged with the base for absorbing heat from the electronic device and spreading the heat to the base, each of the two first heat pipes being sinuous and defining two U-shaped portions on the base;
- two second heat pipes thermally engaged with the base for absorbing heat from the electronic device and spreading the heat to the base, each of the two second heat pipes having a first section located at a corresponding one of the two U-shaped portions on the base;
- and
- a fin set located on the base for dissipating heat in the base to ambient air.
Dependencies are inferred from the claim text.