Heat dissipation device with heat pipes

A heat dissipation device for dissipating heat generated by an electronic device, the heat dissipation device comprising:

• a base comprising a receiving portion for contacting and absorbing heat from the electronic device and an extension portion surrounding the receiving portion for distributing heat from the receiving portion thereto;
• a fin set thermally contacting the base;
• a first heat pipe located on the base, and comprising a plurality of sections thermally engaged with the extension portion and the receiving portion of the base;
• a second heat pipe thermally engaged with the extension portion and the receiving portion of the base;
• wherein the sections of the first heat pipe on the receiving portion and the extension portion of the base cooperatively define at least a U-shaped portion on the base, the second heat pipe surrounds the at least one U-shaped portion of the first heat pipe on the base.

A base of a heat dissipation device, comprising:

• a metallic plate having a bottom surface with a receiving portion for thermally engaging with a heat-generating electronic component and an extension portion surrounding the receiving portion;
• first and second pipes mounted on a top surface of the metallic plate, wherein the first heat pipe is substantially S-shaped including two U-shaped portions and the second heat pipe is substantially U-shaped and surrounds one of the two U-shaped portions of the first heat pipe;
• wherein
• a middle linear section of the first heat pipe and an adjacent linear section of the second heat pipe are located corresponding to the receiving portion of the base, and other sections of the first and second heat pipes are located corresponding to the extension portion of the base.