Low temperature bonding material and bonding method
AssigneeHitachi, Ltd.
InventorsYusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii
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Abstract
A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
Claims14
A bonding material comprising first metal particles, which are coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises a first portion having a particle size of 100 nm or less, and a second portion having a particle size larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base.
A bonding material comprising metal particles having an average particle size of 1 nm to 100 nm, and aggregated particles having a particle size of 10 nm to 100 μm, wherein the aggregated particles are an aggregate of the metal particles.
A bonding method for electrically connecting an electrode of an electronic element and a wiring of a wiring substrate, comprising:
- applying a bonding material comprising metal particles having an average particle size of 100 nm or less, the metal particles being coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion of 100 nm to 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base to a bonding face where the electrode of the electronic element is to be placed on the wiring substrate;
- mounting an electronic element on the bonding material;
- and
- heating the electrode at least in the bonding area under a pressure to thereby bonding the electrode and the wiring of the wiring substrate.
Dependencies are inferred from the claim text.