Sensor Component With a Cavity Housing and a Sensor Chip and Method for Producing the Same

A method for producing a sensor component comprising:

• producing a housing with a cavity and including internal conductor tracks and external connections electrically connected to the internal conductor tracks, the internal conductor tracks comprising contact pads, wherein the housing cavity is defined between a base of the housing and side walls of the housing that surround the housing base;
• filling the housing base with a rubber-elastic layer comprising cleavable organometallic or inorganic metal-containing complexes disposed within the rubber-elastic layer;
• embedding a sensor chip within the rubber-elastic layer disposed within the housing cavity such that a rear side and edge sides of the sensor chip are disposed within the rubber-elastic layer, the sensor chip including a sensor region;
• selectively irradiating a top side of the rubber-elastic layer to cleave at least some of the complexes disposed within the rubber-elastic layer and uncover metals within the cleaved complexes so as to form patterned metallic nucleation layers for wiring lines along the top side of the rubber-elastic layer;
• selectively depositing metals on the patterned nucleation layers to form wiring lines between the sensor region of the sensor chip and the contact pads;
• and
• applying a rubber-elastic covering layer in the cavity of the cavity housing.