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US 2008/0172872 A1Published application
High speed interconnect
AssigneeIntel Corporation
InventorsStephen H. Hall, Bryce D. Horine, Gary A. Brist, Howard Heck
Life of this patent
Estimating the term…
Abstract
In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.
Claims12
1-9. (canceled)
A method of forming a high speed interconnect comprising:
- creating a trench in a layer of FR4 material;
- inserting a homogenous material into the trench;
- and
- forming a pair of transmission lines near the trench.
1 more element
20-32. (canceled)
Dependencies are inferred from the claim text.