Methods and systems for processing semiconductor workpieces
AssigneeMicron Technology, Inc.
InventorsKia Heng Puah, Liang Chee Tay
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Abstract
Methods and systems for processing semiconductor workpieces are disclosed herein. In one embodiment, a method for processing a semiconductor workpiece includes releasably attaching a plurality of microelectronic dies to a first side of a releasable film, and at least partially detaching one of the dies from the releasable film by pivoting a contact member with a surface of the contact member pressing against a second side of the releasable film.
Claims20
A method for processing a semiconductor workpiece, the method comprising:
- releasably attaching a microelectronic die to a first side of a releasable film;
- and
- pivoting a contact member such that a surface of the contact member presses against a second side of the releasable film and detaches the die from the releasable film.
A method for decoupling a microelectronic die from a first side of a film, the method comprising:
- applying a first force against a second side of the releasable film such that the microelectronic die moves in a first direction at a first speed;
- and
- after applying the first force, applying a second force against the second side of the film such that the microelectronic die moves in the first direction at a second speed different than the first speed.
A method for processing a microelectronic die attached to a first side of a releasable attachment member, the method comprising:
- contacting a second side of the releasable attachment member with an arcuate surface;
- and
- moving the arcuate surface relative to the releasable attachment member to at least partially decouple the microelectronic die from the releasable attachment member, the second side being opposite the first side.
20-36. (canceled)
Dependencies are inferred from the claim text.