Method for Analyzing Component Mounting Board

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on a basis of an external geometry of the multilayer wiring board, wiring patterns of the layers and a position of land to which the component is surface-mounted and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• generating a multilayer component shell model divided by element division lines based on a bonding position to the surface of the multilayer wiring board of the component;
• forming an analysis model by bonding a neutral substrate plane computed from the multilayer substrate shell model and a neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component;
• and
• computing deformation by applying boundary conditions to the analysis model.

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on the basis of an external geometry of the multilayer wiring board and wiring patterns of the layers and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• reading a multilayer component shell model from a component data library recording the multilayer component shell model, mapped to each component, element-divided on the basis of an external geometry and internal structure of the component and a bonding division line passing through the bonding position of the component to the surface of the multilayer wiring board;
• redividing a mounting position of the component of the multilayer substrate shell model with the element division lines of the multilayer component shell model;
• forming an analysis model by bonding a neutral substrate plane computed from the redivided multilayer substrate shell model and a neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component;
• and
• computing deformation by applying boundary conditions to the analysis model.

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on the basis of an external geometry of the multilayer wiring board, wiring patterns of the layers and a position of land to which the component is surface-mounted and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• reading a multilayer component shell model from a component data library recording the multilayer component shell model, mapped to each component, element-divided on the basis of an external geometry and internal structure of the component and a bonding division line passing through the bonding position of the component to the surface of the multilayer wiring board;
• forming an analysis model by bonding a neutral substrate plane computed from the redivided multilayer substrate shell model and a neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component;
• and
• computing deformation by applying boundary conditions to the analysis model.

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on the basis of an external geometry of the multilayer wiring board and wiring patterns of the layers and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• reading a neutral component plane from a component data library recording the neutral component plane, mapped to the component, computed from a multilayer component shell model element-divided on the basis of an external geometry and internal structure of the component and a bonding division line passing through a bonding position of the component to the surface of the multilayer wiring board;
• redividing a mounting position of the component of the multilayer substrate shell model with the element division lines of the multilayer component shell model;
• forming an analysis model by bonding a neutral substrate plane computed from the redivided multilayer substrate shell model and a neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component;
• and
• computing deformation by applying boundary conditions to the analysis model.

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on the basis of an external geometry of the multilayer wiring board, wiring patterns of the layers and a position of land to which the component is surface-mounted and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• reading a neutral component plane from a component data library recording the neutral component plane, mapped to the component, computed from a multilayer component shell model element-divided on the basis of an external geometry and internal structure of the component and a bonding division line passing through a bonding position of the component to the surface of the multilayer wiring board;
• forming an analysis model by bonding a neutral substrate plane computed from the redivided multilayer substrate shell model and the neutral component plane with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component;
• and
• computing deformation by applying boundary conditions to the analysis model.

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on the basis of an external geometry of the multilayer wiring board and wiring patterns of the layers and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• generating a multilayer component shell model divided by element division lines based on a bonding position to the surface of the multilayer wiring board of the component;
• generating an intermediate bonding file to connect an intersection of element division lines of a model of one side of the multilayer substrate shell model and the multilayer component shell model with an intersection of element division lines closest to the model of the other side on the basis of a distance from an intersection of element division lines closest to the model of the other side and rigidity therebetween when the multilayer component shell model whose element division line position is different from that of the multilayer substrate shell model is bonded in a mounting position of the component to a surface of the multilayer substrate shell model;
• forming an analysis model by bonding a neutral substrate plane computed from the multilayer substrate shell model and a neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component in the intermediate bonding file;
• and
• computing deformation by applying boundary conditions to the analysis model.

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on a basis of an external geometry of the multilayer wiring board and wiring patterns of the layers and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• reading a multilayer component shell model from a component data library recording the multilayer component shell model, mapped to each component, element-divided on the basis of an external geometry and internal structure of the component and a bonding division line passing through the bonding position of the component to the surface of the multilayer wiring board;
• generating an intermediate bonding file to connect an intersection of element division lines of a model of one side of the multilayer substrate shell model and the multilayer component shell model with an intersection of element division lines closest to the model of the other side on the basis of a distance from an intersection of element division lines closest to the model of the other side and rigidity therebetween when the multilayer component shell model whose element division line position is different from that of the multilayer substrate shell model is bonded in a mounting position of the component to a surface of the multilayer substrate shell model;
• forming an analysis model by bonding a neutral substrate plane computed from the multilayer substrate shell model and a neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component in the intermediate bonding file;
• and
• computing deformation by applying boundary conditions to the analysis model.

A method for analyzing a component mounting board, comprising:

• when physical properties of the component mounting board in which a component is mounted to a surface of a multilayer wiring board are analyzed,
• generating single layer models of layers internally divided by element division lines on the basis of an external geometry of the multilayer wiring board and wiring patterns of the layers and generating a multilayer substrate shell model in which the single layer models of the layers are stacked in the geometry of the multilayer wiring board using thickness information of each of the layers of the multilayer wiring board;
• reading a neutral component plane from a component data library recording the neutral component plane, mapped to the component, computed from a multilayer component shell model element-divided on the basis of an external geometry and internal structure of the component and a bonding division line passing through a bonding position of the component to the surface of the multilayer wiring board;
• generating an intermediate bonding file to connect an intersection of element division lines of a model of one side of the multilayer substrate shell model and the multilayer component shell model with an intersection of element division lines closest to the model of the other side on the basis of a distance from an intersection of element division lines closest to the model of the other side and rigidity therebetween when the multilayer component shell model whose element division line position is different from that of the multilayer substrate shell model is bonded in a mounting position of the component to a surface of the multilayer substrate shell model;
• forming an analysis model by bonding a neutral substrate plane computed from the multilayer substrate shell model and the neutral component plane computed from the multilayer component shell model with one of a beam element and a solid element serving as a bonding element equivalent to mounting conditions of the component in the intermediate bonding file;
• and
• computing deformation by applying boundary conditions to the analysis model.