Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
AssigneeKLA-Tencor Corporation
InventorsAllen Park, Peter Rose, Ellis Chang, Brian Duffy, Mark McCord, Gordon Abbott
Life of this patent
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Abstract
Various methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions are provided. One computer-implemented method includes using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions. The one or more defect-related functions include one or more post-mask, defect-related functions.
Claims86
A computer-implemented method, comprising using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions, wherein the one or more defect-related functions comprise one or more post-mask, defect-related functions.
A carrier medium, comprising program instructions executable on a computer system for performing a computer-implemented method, wherein the computer-implemented method comprises using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions, and wherein the one or more defect-related functions comprise one or more post-mask, defect-related functions.
A system configured to perform a computer-implemented method, comprising a computer system configured to perform the computer-implemented method, wherein the computer-implemented method comprises using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions, and wherein the one or more defect-related functions comprise one or more post-mask, defect-related functions.
Dependencies are inferred from the claim text.