Nanoimprinting composition
AssigneeChisso Corporation
InventorHiroyuki Satou
Life of this patent
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Abstract
The invention provides a nanoimprinting composition that has good heat resistance and with which a relief pattern that has been formed is not readily eliminated by heating. A relief pattern can be formed easily and efficiently in this nanoimprinting composition. This is accomplished by a nanoimprinting composition including a polyamic acid (B) and an epoxy resin (C), and also accomplished by a nanoimprinting composition including a polyester-polyamic acid (A1) and an epoxy resin (C).
Claims22
A nanoimprinting composition comprising a polyamic acid (B) and an epoxy resin (C).
A nanoimprinting composition, comprising approximately 2 to approximately 40 wt % a polyamic acid (B) obtained by reacting one or more diamines selected from the group of 4,4′-diaminodiphenylsulfone, 3,3′-diaminodiphenylsulfone, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylmethane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, and compounds represented by Formula (b):
- wherein R3 and R4 are each independently a C1 to C3 alkyl or phenyl, each R5 is independently a methylene, phenylene, or alkyl-substituted phenylene, each x is independently an integer from approximately 1 to approximately 6, and y is an integer from approximately 1 to approximately 100;
- with one or more tetracarboxylic dianhydrides selected from the group of pyromellitic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, 3,3′,4,4′-diphenyl ether tetracarboxylic dianhydride, and 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride;
- and approximately 2 to approximately 40 wt % of one or more epoxy resins (C) selected from the group of compounds represented by Formulas (220) to (223):
- wherein n is an integer from approximately 0 to approximately 10.
A nanoimprinting composition comprising one or more compounds selected from the group of polyester-polyamic acids (A1) having structural units represented by Formulas (1) and (2):
- wherein R1, R2, and R3 are each independently a C2 to C100 organic group;
- and polyester-polyimides (A2) having structural units represented by Formulas (3) and (2):
- wherein R1, R2, and R3 are each independently a C2 to C100 organic group;
- and
- an epoxy resin (C).
A nanoimprinting composition comprising one or more compounds selected from the group of polyester-polyamic acids (A1) obtained using a polyhydric hydroxy compound (a1), a diamine (a2) and a compound having two or more acid anhydride groups (a3), and polyester-polyimides (A2) that are imidization products thereof, and an epoxy resin (C).
A nanoimprinting composition, comprising approximately 2 to approximately 40 wt % of a polyester-polyamic acid (A1) or polyester-polyimide (A2) obtained by reacting at least one compound of polyhydric hydroxy compound (a1) selected from the group of diethylene glycol, 1,4-butanediol, and trimethylolpropane, at least one compound of diamine (a2) selected from the group consisting of 4,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane and compounds expressed by Formula (b), and a compound having two or more of at least one compound of acid anhydride group (a3) selected from the group of styrene/maleic anhydride copolymers, pyromellitic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, 3,3′,4,4′-diphenyl ether tetracarboxylic dianhydride, and 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride, and at least one epoxy resin of approximately 2 to approximately 40 wt % (C) selected from the group of compounds represented by Formulas (220) to (223):
- wherein n is an integer from approximately 0 to approximately 10.
Dependencies are inferred from the claim text.