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US 2008/0167209 A1Published application
Process for Removing Contaminant from a Surface and Composition Useful Therefor Description
AssigneeAir Products and Chemicals, Inc.
InventorEmil Anton Kneer
Life of this patent
Estimating the term…
Abstract
Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluo-ride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
Claims9
A fluoride-free aqueous composition comprising
- about 0.005 to about 16% by weight of at least one dicarboxylic acid, salt thereof or mixture thereof;
- about 0.003 to about 4% by weight of at least one hydroxyl carboxylic acid, salt thereof or mixture thereof;
- and the remainder being substantially water;
- and
- having a pH of about 1 to about 4.
2 more elements
Dependencies are inferred from the claim text.