Method and System for Point of Use Recycling of ECMP Fluids
AssigneeApplied Materials, Inc.
InventorsJosh H. Golden, Peter I. Porshnev, Donald Myers
Life of this patent
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AssigneeApplied Materials, Inc.
InventorsJosh H. Golden, Peter I. Porshnev, Donald Myers
Estimating the term…
The present invention generally comprises a method and an apparatus for recycling electrochemical mechanical polishing (ECMP) fluid. A selected portion of used ECMP fluid may be delivered to a recycling unit where the fluid may be refurbished. The concentration of the components that are present in the selected portion of used ECMP fluid may be measured. Based upon the measurements, individual components of the ECMP fluid may be selectively dosed into the selected portion in an amount sufficient to ensure that the selected portion of used ECMP fluid, once refurbished, contains the appropriate concentration of components. Alternatively, a predetermined amount of virgin ECMP fluid may be added to the selected portion. The refurbished ECMP fluid may be recycled into an ECMP system for use in another ECMP process.
An electrochemical mechanical polishing fluid recycling method, comprising:
An electrochemical mechanical polishing fluid recycling method, comprising:
An apparatus, comprising:
An electrochemical mechanical polishing fluid recycling unit, comprising:
Dependencies are inferred from the claim text.