Substrate holding apparatus and polishing apparatus
AssigneeEbara Corporation
InventorsTetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
Life of this patent
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Abstract
A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
Claims11
1-35. (canceled)
A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, said substrate holding apparatus comprising:
- a vertically movable member;
- and
- an elastic member connected to said vertically movable member;
- said elastic member including
- (i) a contact portion to be brought into contact with the substrate, and
- (ii) a circumferential wall extending upwardly from said contact portion and connected to said vertically movable member,
- said circumferential wall having an extendible and contractible portion configured to extend vertically, with said contact portion being kept in contact with the substrate.
Dependencies are inferred from the claim text.