Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

A polishing apparatus for polishing a wafer, said apparatus comprising:

• a load/unload block operable to receive a cassette storing a wafer therein;
• a transport block having a robot for moving the wafer,
• a polishing block having a polishing table and a top ring, said polishing block being operable to polish the wafer;
• a cleaning block operable to clean the polished wafer;
• and
• a control block operable to memorize a relative position of said robot of said transport block with respect to said cassette of said load/unload block through teaching,
• wherein each of said load/unload block, said transport block, said polishing block, and said cleaning block has a control device.

A polishing apparatus for polishing a wafer, said apparatus comprising:

• a load/unload block operable to receive a cassette storing a wafer therein;
• a transport block having a robot for moving the wafer;
• a polishing block having a polishing table and a top ring, said polishing block being operable to polish the wafer;
• a cleaning block operable to clean the polished wafer;
• and
• a control block operable to memorize a relative position of said robot of said transport block with respect to said cleaning block through teaching,
• wherein each of said load/unload block, said transport block, said polishing block, and said cleaning block has a control device.