Nanotopography control and optimization using feedback from warp data
AssigneeMEMC Electronic Materials, Inc.
InventorsSumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama
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Abstract
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
Claims25
A method of processing a wafer using a double side grinder, said double side grinder having at least a pair of grinding wheels, said method comprising:
- receiving data obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder, said received warp data being indicative of the measured warp;
- predicting a nanotopography of the wafer based on the received warp data;
- determining a grinding parameter based on the predicted nanotopography of the wafer;
- adjusting operation of the double side grinder based on the determined grinding parameter.
A computer-implemented method of improving nanotopography of a wafer ground by a double side grinder, said double side grinder having at least a pair of grinding wheels, said method comprising:
- receiving data indicative of a profile of a wafer as ground by the double side grinder;
- executing a fuzzy logic algorithm to determine a grinding parameter as a function of the received data;
- and
- providing feedback including the determined grinding parameter to the double side grinder to adjust the operation thereof.
(canceled)
A system for processing a semiconductor wafer, said system comprising:
- a double side grinder having a pair of wheels for grinding a wafer;
- a measurement device for measuring data indicative of a profile of the ground wafer;
- and
- a processor configured for determining a grinding parameter as a function of the measured data and a fuzzy logic algorithm;
- wherein at least one of the wheels of the double side grinder is adjusted based on the determined grinding parameter.
Dependencies are inferred from the claim text.