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US 2008/0166939 A1Published application
Acoustical Substrate
AssigneeFreudenberg Nonwovens Ltd.
InventorsKeith Black, Michael L. Reynolds
Life of this patent
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Abstract
The present disclosure provides an acoustical substrate including nonwoven material which includes a two component adhesive system which may be treated with a fluid repelling compound. The two component adhesive system may comprise two adhesive components having different melting points to allow for flexible industrial post processing and laminating. The adhesives may be applied by a variety of methods and may exist in the substrate in, e.g., either discrete or continuous web forms.
Claims25
An acoustical substrate, comprising;
- a nonwoven web, and
- a first adhesive having a first melting temperature (Tm1) and a second adhesive having a second melting temperature (Tm2) wherein Tm1 is not equal to Tm2;
- and
- a fluid repellant dispersed in said non-woven web.
1 more element
A process for forming an acoustical substrate comprising:
- providing a first nonwoven web;
- applying a first adhesive having a first melting temperature (Tm1) and a second adhesive having a second melting temperature (Tm2) wherein Tm1 is less than Tm2;
- providing a first sound attenuating component and laminating at a temperature above Tm1 while maintaining said laminating temperature at a temperature below Tm2;
- and
- providing a second sound attenuating component and laminating at a temperature above Tm2.
2 more elements
Dependencies are inferred from the claim text.