Substrate Processing Apparatus and Producing Method of Semiconductor Device
AssigneeHitachi Kokusai Electric Inc.
InventorsHironobu Miya, Taketoshi Sato, Norikazu Mizuno, Masanori Sakai, Takaaki Noda
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AssigneeHitachi Kokusai Electric Inc.
InventorsHironobu Miya, Taketoshi Sato, Norikazu Mizuno, Masanori Sakai, Takaaki Noda
Estimating the term…
A substrate treating apparatus is provided with a treatment chamber, a holding member, a heating member, and supplying members for alternately supplying the treatment chamber with first and second reacting substances. The apparatus is provided for forming a thin film on a substrate by supplying the first reacting substance to have the first reacting substance adsorbed on the substrate, removing the excess first reacting substance, then, supplying the second reacting substance to have it adsorbed on the substrate, and reacting it with the first reacting substance. The apparatus is provided with a control part for permitting the apparatus to perform the thin film forming treatment in a status where the number of product substrates lacks, in the case where the number of sheets of the product substrates held by the holding member is less than the maximum number of the product substrates that can be held by the holding member.
A substrate processing apparatus, comprising:
A producing method of a semiconductor device, comprising:
Dependencies are inferred from the claim text.