Method of bonding a solder ball and a base plate and method of manufacturing packaging structure of using the same

Abstract

A method of bonding a solder ball and a base plate and a method of manufacturing a packaging structure using the same are provided. The method of bonding a solder ball and a base plate includes the following steps. First, a base plate including an electrode layer and a base material layer is provided. The electrode layer is disposed on the base material layer. Next, a barrier layer is formed on the electrode layer. Then, a metal layer is formed on the barrier layer. The thickness of the metal layer is about 10˜18 micrometers. Further, a solder ball is disposed on the metal layer. Afterwards, the solder ball, the metal layer, the barrier layer and the electrode layer are heated to a reacting temperature and kept for a holding time.

Dependencies are inferred from the claim text.