Method for fabricating a sensor semiconductor device with sensor chip

A method for fabricating a sensor semiconductor device, comprising the steps of:

• mounting at least one sensor chip on at least one substrate having a first surface and a corresponding second surface, the sensor chip having an active surface and a corresponding non-active surface, wherein the first surface of the substrate is formed with a plurality of connecting pads, the active surface of the sensor chip is formed with a sensor region and a plurality of electrode pads, and the non-active surface of the sensor chip is attached to the first surface of the substrate;
• applying a dielectric layer on the substrate and the sensor chip, wherein the dielectric layer is formed with a plurality of first openings corresponding in position to the connecting pads of the substrate and the electrode pads of the sensor chip;
• forming a circuit layer on the dielectric layer, wherein the circuit layer is electrically connected to the connecting pads of the substrate and the electrode pads of the sensor chip;
• forming a second opening in the dielectric layer at a position corresponding to the sensor region of the sensor chip;
• and
• providing a light-penetrable lid to cover the second opening of the dielectric layer corresponding to the sensor region of the sensor chip.