Image sensor and manufacturing method thereof

A method of manufacturing an image sensor, the method comprising:

• disposing a light source that irradiates a light on an object and a lens body that converges a reflection of the light from the object;
• arranging a plurality of IC chips that receive the reflection passed through the lens body, along the lens body;
• forming a plurality of grooves on a surface of a transparent member at a constant interval according to gaps between adjacent IC chips;
• and
• disposing the transparent member between the IC chips and the lens body so that each of the grooves is opposite to each of the gaps between the adjacent IC chips.

A method of manufacturing an image sensor comprising:

• disposing a light source that irradiates a light on an object and a lens body that converges a reflection of the light from the object;
• arranging a plurality of IC chips that receive the reflection passed through the lens body, on a sensor substrate;
• forming a plurality of grooves on a surface of a transparent member according to gaps between adjacent IC chips, respectively;
• supporting the transparent member between the lens body and the IC chips;
• forming solder resist patterns on the sensor substrate according to the grooves, respectively, and forming a die bond pattern so as to extend over the solder resist patterns;
• and
• disposing end portions of each of the adjacent IC chips on the die bond pattern of the solder resist pattern.