Resin Cured Film for Flexible Printed Wiring Board and Production Process Thereof
AssigneeShowa Denko K.K.
InventorHirofumi Inoue
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Abstract
A insulating resin cured film provided after the formation of tin plating, substantially containing no copper, on a flexible printed wiring board for electronic component, wherein the glass transition temperature of the film after being cured is 80° C. or less, and a process for producing the same. There is provided a flexible printed wiring board with tin plating substantially containing no copper for an electronic component, having coated thereon a resin cured film of photocurable and thermosetting resin, in which fewer copper is diffused in a pure tin plating layer, in comparison with that provided by a prior method.
Claims8
A insulating resin cured film of photocurable and thermosetting resin to be formed after the formation of a tin plating substantially containing no copper in a flexible printed wiring board for electronic component, the insulating resin cured film having a glass transition temperature of 80° C. or less after the curing thereof.
A photocurable and thermosetting resin composition, containing:
- (A) a photosensitive prepolymer having at least two unsaturated double bonds and at least one carboxyl group in one molecule, (B) an epoxy resin compound having at least two epoxy groups in one molecule and having a melting or softening point of 120° C. or less, (C) a photopolymerization initiator, and (D) a diluent.
Dependencies are inferred from the claim text.