Method for bonding a die or substrate to a carrier
AssigneeInteruniversitair Microelektronica Centrum (IMEC)
InventorsBart Swinnen, Eric Beyne
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Abstract
A method is disclosed for bonding two elements by means of a bonding agent such as a glue layer, wherein the bonding agent is removable, and wherein between the bonding agent and at least one element, a sacrificial layer is applied which is selectively removable with respect to that element. According to embodiments, the elements comprise a die or a substrate bonded to a carrier wafer. The nature and type of the die or substrate and of the carrier can vary within the scope of embodiments of the invention. Also disclosed is a composite substrate obtainable by methods of the invention.
Claims21
A method for bonding and releasing a first element to and from a second element, the method comprising:
- providing a first element having a main surface;
- providing a sacrificial layer on the main surface of the first element, the sacrificial layer being selectively removable with respect to the first element;
- providing a second element having a main surface;
- applying a removable attachment layer on top of the sacrificial layer or on top of the main surface of the second element;
- bonding the first element to the second element by contacting one element to the removable attachment layer present on the other element, thereby obtaining a composite substrate;
- subjecting the composite substrate to a temperature increase, wherein the first and second elements are released or become easily releasable due to a phase change of the removable attachment layer;
- and
- removing the sacrificial layer after the release of the first and second elements by an etching agent or a solvent, thereby also removing residues left from the removable attachment layer.
A composite substrate comprising a first element bonded to a second element by a bonding layer, wherein the bonding layer comprises:
- a sacrificial layer selectively removable with respect to the first element in contact with a first main surface of the first element;
- and
- a removable attachment layer in contact with the sacrificial layer comprising a material that can change from solid to non solid phase at a temperature below a critical temperature.
Dependencies are inferred from the claim text.