Metal film pattern forming method
AssigneeSumitomo Electric Industries, Ltd.
InventorKazuo Nakamae
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Abstract
The present invention relates to a metal film pattern forming method by which a metal film pattern can be formed easily on a substrate. In the method, a metal film is caused to adhere to the surface of a substrate comprised of an insulating material having heat resistant properties. By illuminating a laser beam on the metal film on the substrate directly or via a glass plate, abrasion is caused on a portion of the metal film that is illuminated with the laser beam. A substrate having a metal film pattern adhered to the surface thereof is obtained through the abrasion by separating the metal film from the substrate surface after the illumination of the laser.
Claims4
A metal film pattern forming method of forming a metal film pattern on a surface of a substrate, comprising the steps of:
- placing a metal film on the surface of said substrate in a state in which said metal film directly contacts said substrate;
- causing abrasion on a portion of said metal film that is illuminated with a laser beam, by illuminating the laser beam on said metal film from the side opposite to the substrate side thereof;
- and
- separating the remaining of said metal film, excluding a metal film pattern formed through the abrasion and adhered on said substrate, from the surface of said substrate.
Dependencies are inferred from the claim text.