Process control method, data registration program, and method for manufacturing electronic device

A data registration program for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the data registration program registering each of the data by causing a computer to execute:

• retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein;
• calculating representative data for each of the components from the printing quality data;
• and
• recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder.

A method for manufacturing an electronic device with components packaged on a substrate, the method comprising:

• printing solder on a surface of the substrate;
• inspecting the printed solder and recording printing quality data in a primary recorder;
• mounting the components on the substrate with the solder printed;
• inspecting a state of the mounted components and recording mounting quality data in the primary recorder;
• heating the solder to solder the components to the substrate;
• inspecting a state of the soldering and recording soldering pass/fail data in the primary recorder;
• retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from the primary recorder, calculating representative data for each of the components from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;
• determining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder;
• and
• adjusting the solder printer in response to the determination in the determining step that the solder printer needs adjustment, and adjusting the mounter in response to the determination in the determining step that the mounter needs adjustment.