Microelectronic assembly with multi-layer support structure
AssigneeTessera, Inc.
InventorsMichael J. Nystrom, Giles Humpston
Life of this patent
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Abstract
A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.
Claims28
A method of forming a microelectronic assembly, the method comprising:
- positioning a support structure adjacent to an active region of a device but not extending onto the active region,
- wherein the support structure has planar sections, each planar section having a substantially uniform composition, and
- wherein the composition of at least one of the planar sections differs from the composition of at least one of the other planar sections;
- positioning a lid in contact with the support structure and extending over the active region;
- and
- bonding the support structure to the device and to the lid.
A microelectronic assembly comprising:
- a device having an active region;
- a support structure adjacent to the active region but not extending onto the active region;
- and
- a lid in contact with the support structure and extending over the active region,
- wherein the support structure has planar sections, each planar section having a substantially uniform composition, and
- wherein the composition of at least one of the planar sections differs from the composition of at least one other of the other planar sections.
Dependencies are inferred from the claim text.