US 2008/0165518 A1 · Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles

Abstract

A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.

Claims20

Dependent claims

A flip chip mounting process for electrically interconnecting a first electronic component and a second electronic component, the process comprising the steps of:

(i) preparing a first electronic component on which a plurality of electrodes (a) are formed and a second electronic component on which a plurality of electrodes (b) are formed;
(ii) disposing electrically-conductive particles on said electrodes (a) and/or said electrodes (b);
(iii) supplying a composition comprising solder powder, a convection additive and a resin component onto said second electronic component;
(iv) bringing said first electronic component into contact with the supplied composition such that said electrodes (a) are opposed to said electrodes (b);
and
(v) heating said supplied composition, and thereby connections which electrically interconnect said electrodes (a) and said electrodes (b) are formed from said electrically-conductive particles and said solder powder.

3 more elements

Dependencies are inferred from the claim text.

Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles

Life of this patent

Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles

Life of this patent

Abstract

Claims20