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AssigneeShinko Electric Industries Co., Ltd.
InventorsAkinobu Inoue, Sadakazu Akaike, Atsunori Kajiki, Yuya Yoshino, Takashi Tsubota, Norio Yamanishi
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It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.
An electronic component built-in substrate comprising:
A method for manufacturing an electronic component built-in substrate wherein an electronic component is mounted between a first wiring board and a second wiring board, the first wiring board and the second wiring board are electrically connected to each other, and a seal resin is injected into a gap between the first wiring board and the second wiring board,
A method for manufacturing an electronic component built-in substrate wherein an electronic component is mounted between a first wiring board and a second wiring board, the first wiring board and the second wiring board are electrically connected to each other, and a seal resin is injected into a gap between the first wiring board and the second wiring board,
Dependencies are inferred from the claim text.