Control Device and Method of Manufacturing Thereof
AssigneeHitachi, Ltd.
InventorsTakuya Mayuzumi, Shuji Eguchi, Masahiro Sasaki, Kiyoomi Kadoya
Life of this patent
Estimating the term…
Abstract
A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
Claims16
1-19. (canceled)
A control device comprising:
- plural electronic components for forming a control circuit;
- connector pins for connecting electrically the control circuit to external equipment;
- a circuit board with the connector pins and the plural electronic components installed thereon;
- and
- a metallic member on which the circuit board is mounted, and connected electrically to the circuit board, wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound;
- the control device further comprising solder applied to the circuit board and encapsulated in the resin molding compound together in the plural electronic components, the circuit board and the connector pins,
- wherein the circuit board and the metallic member are electrically connected with each other through the solder.
A control device comprising:
- plural electronic components for forming a control circuit;
- connector pins for connecting electrically the control circuit to external equipment;
- a circuit board with the connector pins and the plural electronic components installed thereon;
- and
- a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,
- wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound;
- the control device further comprising a metallic spacer fixed to the circuit board and encapsulated with the resin molding compound together in the plural electronic components, the circuit board and the connector pins,
- wherein the circuit board and the metallic member are electrically connected with each other through the metallic spacer.
A control device comprising:
- plural electronic components for forming a control circuit;
- connector pins for connecting electrically the control circuit to external equipment;
- a circuit board with the connector pins and the plural electronic components installed thereon;
- and
- a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,
- wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound;
- wherein the circuit board and the metallic member are electrically bonded with each other through a conductive adhesive.
A control device comprising:
- plural electronic components for forming a control circuit;
- connector pins for connecting electrically the control circuit to external equipment;
- a circuit board with the connector pins and the plural electronic components installed thereon;
- and
- a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,
- wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound, and at least partial region of the resin molding compound are sandwiched by the metallic member, and
- wherein a thermal expansion coefficient of the resin molding compound is smaller than that of the metallic member.
A control device comprising:
- plural electronic components for forming a control circuit;
- connector pins for connecting electrically the control circuit to external equipment;
- a circuit board with the connector pins and the plural electronic components installed thereon;
- and
- a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,
- wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound, and at least partial region of the resin molding compound are sandwiched by the metallic member,
- the control device further comprising solder applied to the circuit board and encapsulated in the resin molding compound together in the plural electronic components, the circuit board and the connector pins,
- wherein the circuit board and the metallic member are electrically connected with each other through the solder.
A control device comprising:
- plural electronic components for forming a control circuit;
- connector pins for connecting electrically the control circuit to external equipment;
- a circuit board with the connector pins and the plural electronic components installed thereon;
- and
- a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,
- wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound, and at least partial region of the resin molding compound are sandwiched by the metallic member,
- the control device further comprising a metallic spacer fixed to the circuit board and encapsulated with the resin molding compound together in the plural electronic components, the circuit board and the connector pins,
- wherein the circuit board and the metallic member are electrically connected with each other through the metallic spacer.
A control device comprising:
- plural electronic components for forming a control circuit;
- connector pins for connecting electrically the control circuit to external equipment;
- a circuit board with the connector pins and the plural electronic components installed thereon;
- and
- a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,
- wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound, and at least partial region of the resin molding compound are sandwiched by the metallic member, and
- the circuit board and the metallic member are electrically bonded with each other through a conductive adhesive.
A method of manufacturing a control device, comprising the steps of:
- connecting plural electronic components and connector pins for external connection with a wiring-formed circuit board to form a control circuit;
- encapsulating the plural electronic components, the circuit board and a part of the connector pins with a resin molding compound, and
- connecting the control circuit and the metallic member for mounting the control circuit electrically with each other.
Dependencies are inferred from the claim text.